| 摘要 |
A composition of a thermal interface material is provided. The deficiencies of low thermal conductivity and high thermal resistance in the conventional thermal interface materials are resolved. By using carbon fibers with high thermal conductivity, the thermal conductivity of the thermal interface material can be about 7~10 times higher than the traditional thermal interface materials. The added amount of carbon fibers is less than the added amount of metal or ceramic powders. The dispersion process is thereby improved. Further, the thermal interface material has a phase change temperature at about 40~65° C. Holes, gaps and dents on the surface of device are filled at the normal operation temperature of device to reduce the thermal resistance of the entire device and to increase the interfacial bonding strength.
|
