发明名称 Process and an apparatus for coating printed circuit boards with laser-structurable, thermally curable solder stop lacquers and electroresists
摘要 Disclosed are a method and a device for coating printed boards ( 1 ) with solder stop lacquers and galvanoresists that can be laser-structured and thermally hardened. The device used for carrying out said method comprises at least one roller-type coating plant ( 2 ) with an application roller ( 4 ), a dosing roller ( 5 ) that embodies a dosing gap along with the application roller ( 4 ), a storage container ( 6 ) for the solder stop lacquer or galvanoresist, which is disposed above the roller-type coating plant ( 2 ), means for conveying the printed boards ( 7 ), means for drying the solder stop lacquer ( 11 ), and an apparatus ( 13 ) for turning the coated printed boards. Said roller-type coating plant ( 2 ) is provided with only one coating unit for coating the bottom side of the printed boards.
申请公布号 US2007141263(A1) 申请公布日期 2007.06.21
申请号 US20030531394 申请日期 2003.10.14
申请人 SCHAEFER HANS-JURGEN 发明人 SCHAEFER HANS-JURGEN
分类号 B05D5/12;B05C1/00;B05C1/02;B05C1/06;B05C1/08;B05C9/14;B05D3/12;H05K3/00;H05K3/28 主分类号 B05D5/12
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