发明名称 High impedance electromagnetic surface and method
摘要 A high impedance surface ( 300 ) has a printed circuit board ( 302 ) with a first surface ( 314 ) and a second surface ( 316 ), and a continuous electrically conductive plate ( 319 ) disposed on the second surface ( 316 ) of the printed circuit board ( 302 ). A plurality of electrically conductive plates ( 318 ) is disposed on the first surface ( 314 ) of the printed circuit board ( 302 ), while a plurality of elements are also provided. Each element comprises at least one of (1) at least one multi-layer inductor ( 330, 331 ) electrically coupled between at least two of the electrically conductive plates ( 318 ) and embedded within the printed circuit board ( 302 ), and (2) at least one capacitor ( 320 ) electrically coupled between at least two of the electrically conductive plates ( 318 ). The capacitor ( 320 ) comprises at least one of (a) a dielectric material ( 328 ) disposed between adjacent electrically conductive plates , wherein the dielectric material ( 328 ) has a relative dielectric constant greater than 6, and (b) a mezzanine capacitor embedded within the printed circuit board ( 302 ).
申请公布号 US2007139294(A1) 申请公布日期 2007.06.21
申请号 US20050312286 申请日期 2005.12.20
申请人 发明人 DUNN GREGORY J.;CROSWELL ROBERT T.;KUMPF GEORGE H.;SVIGELJ JOHN A.
分类号 H01Q15/24 主分类号 H01Q15/24
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