| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of positively forming electromagnetic shield while easily attaching a lid. SOLUTION: The semiconductor device is provided with a resin layer 4 provided with an opened hole 4c opened on a top surface 4a and a semiconductor sensor chip 5 while positioning a diaphragm 5a on the upper part of the opened hole 4c; a plate-like stage 1 provided on the lower part of the semiconductor sensor chip 5 and sealed with the resin layer 4; a terminal 2 for external connection having one end 2a connected to the stage 1, and provided with one surface 2c exposed from the resin layer 4 on the other end 2b side extending to the outside of the resin layer 4; and a conductive lid 9 for defining a space 8 housing the semiconductor sensor chip 5 together with the top surface 4a of the resin layer 4. The lid 9 is provided with an electromagnetic shield forming terminal 9d having one surface 9g arranged on substantially the same horizontal plane, while being adjacent to one surface 2c of the terminal 2 for external connection. COPYRIGHT: (C)2007,JPO&INPIT |
