摘要 |
PROBLEM TO BE SOLVED: To provide a polyamide/polyphenylene ether resin composition that exhibits excellent heat resistance and attains a high-level balance between flowability (particularly flowability on thin-wall molding) and impact properties while retaining low water absorption and dimensional stability. SOLUTION: The polyamide/polyphenylene ether resin composition comprises 90-30 pts.mass of a semi-aromatic polyamide (A) comprised of a dicarboxylic acid unit (a) containing 60-100 mol% of a terephthalic acid unit and a diamine unit (b) containing 60-100 mol% of a 1,9-nonanediamine unit and/or a 2-methyl-1,8-octanediamine unit, 10-70 pts.mass of a polyphenylene ether (B) and 10-30 pts.mass of a plate-like inorganic filler (C) having an average particle size of at least 9 μm and at most 20 μm and a ratio (d75%/d25%), of the particle size (d75%) of the 75% fraction to the particle size (d25%) of the 25% fraction from the small side in particle size, of at least 1.0 and at most 2.5. COPYRIGHT: (C)2007,JPO&INPIT
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