发明名称 POLYAMIDE/POLYPHENYLENE ETHER RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a polyamide/polyphenylene ether resin composition that exhibits excellent heat resistance and attains a high-level balance between flowability (particularly flowability on thin-wall molding) and impact properties while retaining low water absorption and dimensional stability. SOLUTION: The polyamide/polyphenylene ether resin composition comprises 90-30 pts.mass of a semi-aromatic polyamide (A) comprised of a dicarboxylic acid unit (a) containing 60-100 mol% of a terephthalic acid unit and a diamine unit (b) containing 60-100 mol% of a 1,9-nonanediamine unit and/or a 2-methyl-1,8-octanediamine unit, 10-70 pts.mass of a polyphenylene ether (B) and 10-30 pts.mass of a plate-like inorganic filler (C) having an average particle size of at least 9 μm and at most 20 μm and a ratio (d75%/d25%), of the particle size (d75%) of the 75% fraction to the particle size (d25%) of the 25% fraction from the small side in particle size, of at least 1.0 and at most 2.5. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007154127(A) 申请公布日期 2007.06.21
申请号 JP20050354772 申请日期 2005.12.08
申请人 ASAHI KASEI CHEMICALS CORP 发明人 NODA KAZUYA;MIYOSHI TAKAAKI
分类号 C08L77/06;C08J3/22;C08K3/04;C08K3/16;C08K5/09;C08K5/098;C08K7/00;C08L71/12 主分类号 C08L77/06
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