| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of protecting an internal wiring or an insulating film from an impact load acting on an electrode pad or tensile force when plucking away a metal thin wire. <P>SOLUTION: A via 36 is arranged in ring between a first electrode pad 32 and a second electrode pad 34. <P>COPYRIGHT: (C)2007,JPO&INPIT |
