| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a process for producing a wiring board in which a build-up wiring layer is formed on a temporary substrate under separable state inexpensively with high reliability without causing any trouble. <P>SOLUTION: An underlying layer 12a is arranged in the wiring formation region A on a prepreg 10a, a metal foil 12b is arranged on the prepreg 10a through the underlying layer 12a such that a metal foil 12b larger than the underlying layer 12a touches the circumferential part B of the wiring formation region A, and then the prepreg 10a is hardened by hot press to obtain a temporary substrate 10. At the same time, the metal foil 12b is bonded to the temporary substrate 10. Subsequently, a build-up wiring layer is formed on the metal foil 12b and the circumferential part of the underlying layer 12a of that structure is cut to separate the metal foil 12b from the temporary substrate 10 thus obtaining a wiring member 30 where a build-up wiring layer is formed on the metal foil 12b. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
