| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of producing a leadframe, which comprises a step of providing a substrate, a step of plating the substrate with a layer of tin, a step of plating a layer of nickel over the layer of tin, and a step of plating one or more protective layers over the layer of nickel. SOLUTION: By heating a leadframe to form one or more intermetallic layers containing tin, diffusion of copper from a base material of the leadframe to the leadframe surface is avoided. COPYRIGHT: (C)2007,JPO&INPIT |
