| 摘要 |
PROBLEM TO BE SOLVED: To provide a piezoelectric oscillator capable of matching the temperature of an integrated circuit element itself with the temperature of a piezoelectric resonator element in a short time on the occurrence of momentary thermal variations due to operations of the integrated circuit element. SOLUTION: In the piezoelectric oscillator wherein a first package body comprising a first space part of a recessed shape formed to a first board, the piezoelectric resonator element mounted in the first space part, and a cover hermetically sealing the first space part, and a second package body comprising a second space part of a recessed shape formed to a second board, and the integrated circuit element with at least a built-in oscillation circuit arranged in the second space part are overlappingly arranged, and the first and second package bodies are mechanically and electrically connected and fixed, thermosetting paste with a thermal conductivity higher than that of the substance configuring the second package body is filled in a space surrounded by an inner side of the second space part located with the integrated circuit element and the other principal side of the first board. COPYRIGHT: (C)2007,JPO&INPIT
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