发明名称 METHOD AND SYSTEM FOR INSPECTING INTEGRATED CIRCUIT
摘要 PROBLEM TO BE SOLVED: To nondestructively inspect the soundness of a circuit including a connection condition, just after mounting an integrated circuit on a board and connecting a bonding wire. SOLUTION: The integrated circuit 10 provided with a protection circuit having an internal circuit protecting diode connected in series to each signal input and output terminal is mounted on the optional circuit board 11 to be inspected under the condition where the signal input and output terminal is electrically connected directly or indirectly to an electric contact 12 of the circuit board 11. An electric power source terminal and a grounding terminal are selected out of the input and output terminals, and an electric contact 14 connected electrically with the electric power source terminal and an electric contact 15 connected electrically with the grounding terminal are short-circuited to connect the first measuring terminal 25. The second measuring terminal 26 is connected to the electric contact connected electrically with anyone of the residual input and output terminals in an integrated circuit chip, via a switch 34. A constant current power source 27 is connected between the first measuring terminal 25 and the second measuring terminal 26, and a fixed measuring current I is supplied along a normal direction of the internal circuit protecting diode to measure a potential between the both measuring terminals 25, 26. It is compared with a preset reference value. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007155640(A) 申请公布日期 2007.06.21
申请号 JP20050354502 申请日期 2005.12.08
申请人 SUNRICH:KK 发明人 OZAKI TADASHI;HASEGAWA TAKESHI;TANGE MASAO
分类号 G01R31/28;G01R31/26 主分类号 G01R31/28
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