发明名称 HEAT INSULATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a heat insulating device exhibiting excellent heat insulating performance, not using lead in order to shield radiation, light in weight, capable of saving labor in manufacturing the device, and capable of being easily cleaned even when being polluted by radiation. SOLUTION: The heat insulating device 1 is equipped with an outer shell comprising an inside plate 2 arranged on a heat insulated body side, an outside plate 3 on its opposite side, and a side plate 4 arranged in the thickness direction; and a plurality of reflecting plates 5 arranged in the outer shell. The inside plate 2, the outside plate 3, the side plate 4 and the reflecting plates 5 are made of metal, and at least the inside plate 2 comprises a tungsten alloy. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007154953(A) 申请公布日期 2007.06.21
申请号 JP20050348862 申请日期 2005.12.02
申请人 A & A MATERIAL CORP 发明人 NAKAJIMA TAKASHI;YANO MASAMI;NEMOTO TETSUJI
分类号 F16L59/08;B32B15/01;C22C27/04;F16L59/147;G21D1/00;G21F3/00 主分类号 F16L59/08
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