发明名称 ADHESIVE TAPE WITH ULTRA THIN METAL FOIL
摘要 PROBLEM TO BE SOLVED: To provide an adhesive tape with an ultra thin metal foil, in which a metal foil is solidly fixed during handling, and, when being peeled, an unnecessary film can be removed simply, and no adhesive deposit remains. SOLUTION: The adhesive tape with the ultra thin metal foil is formed by laminating an adhesive layer (B) and the ultra thin metal foil (C) on a substrate film (A) sequentially. The adhesive tape with the ultra thin metal foil is characterized in that the adhesive layer (B) comprises an adhesive force variable type adhesive in which a peeling becomes easy due to the decrease in adhesive force with an external stimulus, and the ultra thin metal foil (C) is directly formed in a thickness of 9μm or less by any means such as an electroless plating, an electroplating, a deposition, or a sputtering method. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007152869(A) 申请公布日期 2007.06.21
申请号 JP20050354625 申请日期 2005.12.08
申请人 SEKISUI CHEM CO LTD 发明人 KAMIYA NOBUHITO;OYAMA YASUHIKO
分类号 B32B15/08;C23C18/16;C25D1/04;C25D1/20;H05K1/03;H05K3/00 主分类号 B32B15/08
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