| 发明名称 |
Integrated current sensor package |
| 摘要 |
An integrated current sensor package includes an integrated circuit having a coil in a metal layer of the circuit. A wire is placed close enough to the coil such that the coil and the wire are inductively coupled with each other.
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| 申请公布号 |
US2007139066(A1) |
申请公布日期 |
2007.06.21 |
| 申请号 |
US20050311517 |
申请日期 |
2005.12.19 |
| 申请人 |
SILICON LABORATORIES INC. |
发明人 |
DUPUIS TIMOTHY J.;PAVELKA JOHN |
| 分类号 |
G01R31/26 |
主分类号 |
G01R31/26 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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