LEAD FRAME PANEL AND A PLURALITY OF HALF-ETCHED CONNECTION BARS
摘要
<p>A lead frame panel (40) includes a body (42) having an array of die support areas (44) for receiving respective semiconductor dies. The die support areas (44) are surrounded by leads (46). Adjacent rows of leads are coupled by half-etched connection bars (48), such that each half-etched portion of the connection bars (48) forms a channel into which a mold compound (54) is injected.</p>
申请公布号
WO2006101577(A3)
申请公布日期
2007.06.21
申请号
WO2006US01397
申请日期
2006.01.17
申请人
FREESCALE SEMICONDUCTOR, INC.;SHIU, HEI MING;LAI, GOR AMIE;WONG, FEI YING