| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package capable of protecting semiconductor components from external forces as well as maintaining airtightness, and to provide a manufacturing method of the semiconductor package. SOLUTION: A semiconductor component 30 is fixed onto a base film 20 having electrical insulation and flexibility. At least an area above the semiconductor component 30 is covered with an electrically insulating and flexible cover film 34. The semiconductor component 30 is electrically connected to a conductive layer 26, arranged between the base film 20 and the cover film 34. The semiconductor component 30 is packaged in the hollow space formed by the base film 20 and the cover film 34. COPYRIGHT: (C)2007,JPO&INPIT
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