| 摘要 |
PROBLEM TO BE SOLVED: To provide a means for suppressing damage or a break in wiring conductors caused by ultrasonic vibration or the like when the wiring conductors on a flexible insulating substrate are joined to element electrodes of a semiconductor element via projected electrodes in a structure having the insulating substrate and the semiconductor element. SOLUTION: A wiring board 19 has an insulating substrate 10, a plurality of first wiring conductors 11 provided on the substrate, first projected electrodes 13 provided to the first wiring conductors, and one or more second wiring conductors 12 provided to be adjacent to the first wiring conductors outside thereof. A semiconductor chip 18 has a semiconductor element 20, element electrodes 21 provided on the element, and second projected electrodes 22 provided on the element electrodes. When the first projected electrodes of the wiring board are joined to the second projected electrodes of the semiconductor chip to be opposed to each other, electric connection from the first wiring conductors to the semiconductor element is attained. The second wiring conductors are insulated from the second projected electrodes and the semiconductor element because a gap is provided therebetween. COPYRIGHT: (C)2007,JPO&INPIT |
