| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a camera module in which an imaging element is prevented from being influenced by electromagnetic waves and also adhesion strength between the imaging element and a substrate is secured. <P>SOLUTION: A surface-state ground 5a is extended nearly all over the back surface of the imaging element 5, and a land for the ground 6a whose external shape is the same as that of the ground 5a of the imaging element 5 and also which has grating shape is formed on the front surface of the substrate 6. The area of the land for the ground 6a of the substrate 6 is nearly the same as that of the ground 5a of the imaging element 5, and the ground 5a of the imaging element 5 is stuck on the land for the ground 6a of the substrate 6 with a conductive adhesive so as to correspond to the land for the ground 6a of the substrate 6. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
