发明名称 SUBSTRATE WORKING APPARATUS, AND SUBSTRATE WORKING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a substrate working method whose working accuracy and working efficiency of a substrate to be treated is excellent and a substrate working apparatus applying the substrate working method. <P>SOLUTION: The substrate working apparatus includes a holding base 11 on which a substrate to be treated 30 with a plurality of positioning marks 30a is mounted, a working means of working the substrate to be treated, a detecting means 13 of detecting the position of the positioning marks, a movable means 12 of moving the holding base, and a controlling means 10A of controlling the position of the holding base. The detecting means are plurally formed correspondent to the positioning marks, and the controlling means controls the position of the holding base in order so that the working means works a plurality of working points on the substrate to be treated in order, correspondent to the positions of the positioning marks detected by the plurality of detecting means. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007158252(A) 申请公布日期 2007.06.21
申请号 JP20050355133 申请日期 2005.12.08
申请人 SUMITOMO HEAVY IND LTD 发明人 SAKAMOTO MASAKI
分类号 H01L21/268;B23K26/00;B23K26/02;B23K26/08;H01L21/20 主分类号 H01L21/268
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