发明名称 Flow-fill structures
摘要 A preferred embodiment of the invention is directed to support structures such as spacers used to provide a uniform distance between two layers of a device. In accordance with a preferred embodiment, the spacers may be formed utilizing flow-fill deposition of a wet film in the form of a precursor such as silicon dioxide. Formation of spacers in this manner provides a homogenous amorphous support structure that may be used to provide necessary spacing between layers of a device such as a flat panel display.
申请公布号 US2007138930(A1) 申请公布日期 2007.06.21
申请号 US20060507027 申请日期 2006.08.21
申请人 VAARTSTRA BRIAN A 发明人 VAARTSTRA BRIAN A.
分类号 H01J19/42;H01J1/62;H01J1/88;H01J9/00;H01J9/18;H01J9/24;H01J29/86;H01J31/12;H01J63/04;H01K1/18 主分类号 H01J19/42
代理机构 代理人
主权项
地址