发明名称 Etch mask and method of forming a magnetic random access memory structure
摘要 A method for forming an MRAM bit is described that includes providing a covering layer over an integrated circuit structure. In one embodiment, the covering layer includes tantalum. A first mask layer is formed over the covering layer followed by a second mask layer. The first mask layer and second mask layer are etchable by the same etching process. The first and second mask layer are etched. Etch residue is removed from the first and second mask layers. The first mask layer is then selectively removed and the second mask layer remains.
申请公布号 US2007141844(A1) 申请公布日期 2007.06.21
申请号 US20070705211 申请日期 2007.02.12
申请人 MICRON TECHNOLOGY, INC. 发明人 YATES DONALD L.;SIGNORINI KAREN T.
分类号 H01L21/302;H01L21/00;H01L21/3213;H01L21/461;H01L27/22;H01L43/12 主分类号 H01L21/302
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