An apparatus and a method are disclosed for forming an electrical component construction, the method comprising: obtaining a chip webstock containing a plurality of integrated circuit chips; obtaining a label webstock having printed label graphics thereon; cutting the chip webstock into a plurality of chip sections, each of the chip sections including at least one integrated circuit chip; indexing the chip sections from a high density on the chip webstock to a lower density; attaching each of a plurality of the different chip sections on a different label on the label webstock; obtaining an electrical component webstock comprising electrical components on a web; and attaching each of a plurality of the electrical components relative to a different one of the integrated circuit chips on the label webstock to permit an electrical communication therebetween.
申请公布号
WO2007030768(A3)
申请公布日期
2007.06.21
申请号
WO2006US35166
申请日期
2006.09.08
申请人
DELAWARE CAPITAL FORMATION, INC.;MANES, KEVIN, STONE;HOWARD, JOHN, B.