PRINTED CIRCUIT BOARD HAVING HIGH RELIABLE TERMINALS FOR SURFACE MOUNTING, AND MANUFACTURING METHOD THEREOF

摘要

A printed circuit board having high reliable surface mounting terminals and a manufacturing method thereof are provided to prevent the interfacial separation phenomenon between a gold layer and an Ni layer or between the Ni layers. In a printed circuit board having a wire bonding terminal for mounting a semiconductor and a soldering terminal for connecting with external parts, the wire bonding terminal and the soldering terminal are composed of a metal layer and an Ni layer formed on the metal layer. The Ni layer includes triple layers having different phosphorus contents.