| 摘要 |
<P>PROBLEM TO BE SOLVED: To restrict any damage of a bonding wire by a gel member without using a dummy bonding wire in an electronic device obtained by connecting two members by a plurality of bonding wires and sealing the plurality of the bonding wires with the gel member. <P>SOLUTION: In a first wire 51 and a second wire 52 connecting a power IC chip 70 and a circuit board 20, there are intersected in a position relation a line L1 connecting a connection with a pad 70a for gate in the first wire 51 and a connection with a pad 21 of the first circuit board 20, and a line L2 connecting a connection with a pad 70b for source in the second wire 52 and a connection with the pad 21 of the first circuit board 20. <P>COPYRIGHT: (C)2007,JPO&INPIT |
