| 摘要 |
PROBLEM TO BE SOLVED: To enable the determination as to "OK" or "no good" state for individual chips, having a simple structure and a low price. SOLUTION: The fracture strength inspection device for sensor chips 29 conducts a fracture strength inspection for a plurality of the sensor chips 29 with diaphragm 3 arranged on a semiconductor wafer 8. In this case, the device has a stage 23 that has the semiconductor wafer 8 mounted and a nozzle 20 for jetting gas onto the sensor chips 29, having a pressure equivalent to the standard fracture strength of the sensor chips 29. COPYRIGHT: (C)2007,JPO&INPIT
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