| 摘要 |
A wafer processing device is disclosed that includes a processing chamber, which is surrounded by a housing, an arrangement of inlet openings within the processing chamber, which are provided to dispense a liquid, and a rotatable holding device for wafers. Whereby the wafers are disposed in a wafer carrier, which is fixed to the holding device, in which a coating of a fluoropolymer, preferably PTFE, is provided on all parts of the wafer processing device coming into contact with liquid.
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