THERMOSETTING RESIN COMPOSITION

摘要

Disclosed is a thermosetting resin composition which enables to obtain a cured product having excellent heat resistance, electrical characteristics and flexibility. The thermosetting resin composition is excellent in storage stability before curing. Specifically disclosed is a thermosetting resin composition characterized by containing a polyurethane resin (A) having a structure represented by the general formula (1) below and/or the general formula (2) below, and an epoxy resin (B). [Chemical formula 58] (1) [Chemical formula 59] (2) (In the formulae, X represents a residue obtained by removing two phenolic hydroxyl groups from a phenol compound having two or more phenolic hydroxyl groups in a molecule.)