| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bonding wire for a semiconductor element for which loop abnormalities due to the route contamination of an organic substance as residue or an applied substance are prevented, while maintaining proper unwindability and deliverability from a spool, and the short-circuit of the bonding wires with each other or the like will not occur, even in a device for which a pitch is further narrowed in recent years, and to provide its manufacturing method. <P>SOLUTION: An organic coating forming material to be absorbed by the bonding wire is selected, and a cleaning liquid for removing only the organic coating forming materials that are not absorbed by the bonding wire are selected. The manufacturing method comprises an absorption process of forming a coating, by making the entire surface of the bonding wire absorb the organic coating forming material, and a cleaning process of removing the organic coating forming material stuck to the surface, without being absorbed by the bonding wire by cleaning. <P>COPYRIGHT: (C)2007,JPO&INPIT |
