| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a liquid immersion lithography system which minimizes the introduction of particles into the immersion liquid by preventing the immersion liquid from contact with the particulate contamination areas, and which prevents distortions and defects from occurring on the photoresist image and pattern on the wafers. <P>SOLUTION: The system includes a wafer chuck 402, a seal ring 418, a seal ring carrier 502, and a vacuum module. The wafer chuck 402 fixes a wafer 406 onto the top thereof, and performs processing by liquid immersion lithography. The seal ring 418 seals the wafer 406 on the wafer chuck 402. The seal ring carrier 502 loads/unloads the seal ring 418 to/from the wafer chuck 402. The vacuum module makes the wafer 406 and the wafer chuck 402 suck the seal ring 418. <P>COPYRIGHT: (C)2007,JPO&INPIT |
