| 摘要 |
PROBLEM TO BE SOLVED: To provide a photocurable/thermosetting resin composition suitable for an interlaminar insulation resin of a printed wiring board, a solder resist developable by an aqueous alkali solution, or the like, having high flame retardancy passing a UL combustion test, and excellent bleeding out resistance, resilience, folding resistance, adhesion, flexibility, heat resistance at the use of lead-free solder, moisture resistance and insulating properties. SOLUTION: The photocurable/thermosetting resin composition contains (A) a carboxy-modified epoxy (meth)acrylate resin, (B) an epoxy resin, (C) a photopolymerization initiator, (D) a diluent, (E) a curing agent, (F) a phosphorus-containing compound represented by a specific structural formula and (G) aluminum hydroxide as essential components, regulated so that the content of phosphorus in the component (F) based on the components (A) to (E) may be 2.5-4.5 mass%, and the content of the component (G) based on 100 pts.mass of the total of the components (A) to (E) may be 60-80 pts.mass. COPYRIGHT: (C)2007,JPO&INPIT
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