| 发明名称 |
SENSOR CHIP BREAKING STRENGTH INSPECTION APPARATUS AND SENSOR CHIP BREAKING STRENGTH INSPECTION METHOD |
| 摘要 |
A sensor chip breaking strength inspection apparatus that performs sensor chip breaking strength inspection on a semiconductor wafer on which a plurality of sensor chips having a diaphragm portion are disposed includes: a stage on which the semiconductor wafer is mounted; and a nozzle that emits a medium onto the sensor chips at a pressure equivalent to a standard breaking strength of the sensor chips.
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| 申请公布号 |
US2007137310(A1) |
申请公布日期 |
2007.06.21 |
| 申请号 |
US20060279606 |
申请日期 |
2006.04.13 |
| 申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
YABE HIDEKI;SAKAI YUICHI;KAWAMA YOSHITATSU;KUMAGAI MUNEHITO;NAKAOKA YASUYUKI |
| 分类号 |
G01M99/00;G01N3/00 |
主分类号 |
G01M99/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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