发明名称 Method of bonding flying leads
摘要 The method of bonding flying leads is capable of efficiently supersonic-bonding the flying leads to pads of a board and improving bonding reliability therebetween. The method comprises the steps of: positioning the flying leads to correspond to the pads arranged parallel; and applying supersonic vibrations to a bonding tool so as to respectively bond the flying leads to the pads. And widths of the flying leads are wider than those of the pads, and supersonic vibrations are applied to the bonding tool, which is pressing the flying leads onto the pads, so that the flying leads are respectively supersonic-bonded to the pads.
申请公布号 US2007137025(A1) 申请公布日期 2007.06.21
申请号 US20060359427 申请日期 2006.02.23
申请人 FUJITSU LIMITED 发明人 KUBOTA TAKASHI;KOBAE KENJI;NAKAMURA KIMIO
分类号 B23K1/06 主分类号 B23K1/06
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