发明名称 |
Inductor integrated chip and fabrication method thereof |
摘要 |
An inductor integrated chip and fabrication method thereof is provided. The inductor integrated chip includes a wafer; an inductor bonded on a surface of the wafer; a circuit element formed on the surface of the wafer and coupled to a first end of the inductor; a packaging wafer connected to the surface of the wafer and packaging the inductor and the circuit element; and a connecting electrode formed on the packaging wafer and connected to a second end of the inductor. The method includes forming an inductor and a circuit element on a surface of a wafer, wherein the circuit element is coupled to a first end of the inductor; forming a connecting electrode on a packaging wafer; and packaging the inductor and the circuit element by joining the wafer and the packaging wafer so as to connect the connecting electrode with a second end of the inductor.
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申请公布号 |
US2007138594(A1) |
申请公布日期 |
2007.06.21 |
申请号 |
US20060473079 |
申请日期 |
2006.06.23 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE JOO-HO;PARK HAE-SEOK;HA BYEOUNG-JU;HONG SEOG-WOO;CHOI HYUNG;SONG IN-SANG |
分类号 |
H01L29/00 |
主分类号 |
H01L29/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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