An integrated circuit (IC) die/substrate assembly includes an IC die and a substrate that are electrically coupled through an interconnect formed on the IC die. The IC die/substrate assembly further includes at least one coupling that facilitates maintaining an IC die/substrate gap definition between the IC die and the substrate.
申请公布号
US2007139899(A1)
申请公布日期
2007.06.21
申请号
US20050314827
申请日期
2005.12.21
申请人
PALO ALTO RESEARCH CENTER INCORPORATED
发明人
VAN SCHUYLENBERGH KOENRAAD F.;PEETERS ERIC;FORK DAVID K.;HANTSCHEL THOMAS