摘要 |
Disclosed is a plated resin molding with a beautiful appearance, which is high in adhesion strength of the plating. Specifically disclosed is a plated resin molding wherein a metal plating layer is formed on the surface of a resin molding which is composed of a resin composition containing (A) a synthetic resin, (B) 0.1-20 parts by mass of a water-soluble substance having a solubility in water (at 25°C) of from 0.01 g/100g to 10 g/100g, (C) 0-20 parts by mass of a compatibilizer, and (D) 1-55 parts by mass of an inorganic filler per 100 parts by mass of the total of the components (A), (B) and (C). The plated resin molding is further characterized in that the resin molding is not etched by an acid containing chromium and/or manganese. |