发明名称 PLATED RESIN MOLDING
摘要 Disclosed is a plated resin molding with a beautiful appearance, which is high in adhesion strength of the plating. Specifically disclosed is a plated resin molding wherein a metal plating layer is formed on the surface of a resin molding which is composed of a resin composition containing (A) a synthetic resin, (B) 0.1-20 parts by mass of a water-soluble substance having a solubility in water (at 25°C) of from 0.01 g/100g to 10 g/100g, (C) 0-20 parts by mass of a compatibilizer, and (D) 1-55 parts by mass of an inorganic filler per 100 parts by mass of the total of the components (A), (B) and (C). The plated resin molding is further characterized in that the resin molding is not etched by an acid containing chromium and/or manganese.
申请公布号 WO2007069769(A1) 申请公布日期 2007.06.21
申请号 WO2006JP325308 申请日期 2006.12.13
申请人 DAICEL POLYMER LTD.;TAI, TOSHIHIRO 发明人 TAI, TOSHIHIRO
分类号 C23C18/16;B32B15/08;C08K3/00;C08L101/00;C08L101/14 主分类号 C23C18/16
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