| 摘要 |
<P>PROBLEM TO BE SOLVED: To form an electrode which can have sufficient bonding strength without lowering manufacturing efficiency. <P>SOLUTION: A semiconductor has a semiconductor substrate 10, a first electrode 11 provided on an active-surface side of the semiconductor substrate 10, an external terminal 12 provided on the active-surface side while electrically connected to the first electrode 11, and a terminal 13 for connection provided on the active-surface side of the semiconductor substrate. One of a gold plating film, a silver plating film, and a palladium plating film is formed on at least one of the external connection terminal and terminal for connection. <P>COPYRIGHT: (C)2007,JPO&INPIT |
