| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device provided with a relay member by enabling to arbitrarily set a bonding position or connection mode of bonding wires, and a method of manufacturing the semiconductor device which can inexpensively manufacture this semiconductor device. <P>SOLUTION: The semiconductor device 10 is provided with a first semiconductor element 2 and a second semiconductor element 6, and a relay member 4 for relaying connection between the first semiconductor element 2 and the second semiconductor element 6, and connection between the second semiconductor element 6 or a wiring board 1 or a lead frame 22. The relay member 4 is arranged between the first and second semiconductor elements 2 and 6, the entire surface of a main surface of the relay member 4 is made of a conductor, and a bonding wire 7 connects the relay member 4 to the second semiconductor element 6, and connects the relay substrate 4 to the first semiconductor element 2 or the wiring board 1 or the lead frame 22. <P>COPYRIGHT: (C)2007,JPO&INPIT |
