METALLIC FILM-FORMING METHOD, METALLIC FILM-FORMING SUBSTRATE, METALLIC FILM, METALLIC PATTERN-FORMING METHOD, METALLIC PATTERN-FORMING SUBSTRATE, METALLIC PATTERN, AND POLYMER LAYER-FORMING COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a metallic film-forming method and a metallic pattern-forming method capable of forming a metallic film or a metallic pattern having excellent adhesiveness to a smooth substrate without requiring much energy by a simple process, and a metallic film and a metallic pattern having excellent adhesiveness to the smooth substrate manufactured without using much energy in a simple process. SOLUTION: The metallic film-forming method comprises (a) a polymer layer-forming step of forming a polymer layer by directly performing the chemical coupling of polymer having a functional group interacting with a plating catalyst or its precursor, a polymerization group, and a substituent group including a divalent sulfur atom on a substrate, (b) a catalyst providing step of providing an electroless plating catalyst or its precursor to the polymer layer, and (c) a metallic film-forming step of forming a metallic film on the polymer layer by performing the electroless plating. There are provided a metallic film obtained therefrom, the metallic pattern-forming method applying the metallic film-forming method, and the metallic pattern obtained therefrom. COPYRIGHT: (C)2007,JPO&INPIT