| 摘要 |
A method for manufacturing a mounting substrate on which a semiconductor chip is mounted includes: forming a wiring section by electrolytic plating on a first face of a supporting substrate which is made of an insulating material, by supplying electric power from a first power supply layer through a via plug piercing through the supporting substrate, the first power supply layer being formed on a second face of the supporting substrate; performig patterning on the first power supply layer so as to form a first conductive pattern which is connected to the wiring section through the via plug; performing a connection test of the wiring section by using the conductive pattern; mounting the semiconductor chip on the wiring section; and removing the supporting substrate.
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