Blister board article, blister pack system, and processes of making

摘要

A blister-board article is provided that includes a substrate and a unique adhesive material layer that is above the substrate. The blister-board article is useful as a base for an information layer and a blister packaging material that is bonded to the unique adhesive material layer through the information layer. A blister-pack system is also disclosed in which an object is between a blister layer and the adhesive material layer. A process is also disclosed including the formation of a sizing layer upon the substrate. Optionally, a base coat layer is formed, either on a starch sizing layer or directly on the substrate.