| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board and a wiring board connection device capable of easily removing substrates, and capable of surely connecting a wiring pattern on the substrate. SOLUTION: A connection pattern 14 is formed on the inside surface of an opening 10A for inserting a substrate, at a third layer 10-3 of a multilayer substrate 10. The connection pattern 14 is electrically connected to a wiring pattern 12-3. On the lower surface of a flexible substrate 20 in a figure, a wiring pattern 22 and a connection pattern 24 are formed. The connection pattern 24 is electrically connected to the wiring pattern 22. A solder 26 is applied on the surface of the connection pattern 14 or 24. The flexible substrate 20 is inserted in the opening 10A for inserting substrate. The solder 26 is melted by an electric heating pattern or heating beam, so that the connection patterns 14 and 24 are connected. COPYRIGHT: (C)2007,JPO&INPIT |
