| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for thin film device in which a large-sized substrate formed by sticking two substrates together is divided into a plurality of thin film devices, wherein the substrate is made thin and divided irrelevantly to the material of the substrate. SOLUTION: On a device substrate 1 where a plurality of device regions 1a are set, etching preventive patterns 4 are formed on split lines for dividing the respective device regions 1a. Then a counter substrate 5 is stuck on the device substrate 1 on the side where the etching preventive patterns 4 are formed. Groove patterns 13 are formed on the device substrate 1 on the opposite side from the formation surface of the etching preventive patterns 4 while made to correspond to the split lines. Then the device substrate 1 is etched from the surface side where the groove patterns 13 are formed up to the etching preventive patterns 4 to make the device substrate 1 on which the counter substrate 5 is stuck thin, and the device substrate 1 is divided in the groove pattern 13 parts. COPYRIGHT: (C)2007,JPO&INPIT
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