发明名称 Method for determining position of semiconductor wafer, and apparatus using the same
摘要 A light source emits light toward a semiconductor wafer, and a light receiving sensor detects light passing a peripheral edge of the semiconductor wafer. Each coordinates of the peripheral edge of the semiconductor wafer is obtained from a result of the detection. Further, a center of the semiconductor wafer is obtained from a group of the coordinates. Then, an illumination device emits light toward the peripheral edge of the semiconductor wafer and an optical camera detects light reflected from the peripheral edge of the semiconductor wafer. A position of a "V"-shaped notch formed on the peripheral edge of the semiconductor wafer is obtained from a result of the detection. A handling position of the semiconductor wafer is determined based on the center of the semiconductor wafer and the position of the "V"-shaped notch.
申请公布号 US2007139642(A1) 申请公布日期 2007.06.21
申请号 US20060604355 申请日期 2006.11.27
申请人 NITTO DENKO CORPORATION 发明人 IKEDA SATOSHI;YAMAMOTO MASAYUKI
分类号 G01B1/00;H01L21/02;H01L21/68 主分类号 G01B1/00
代理机构 代理人
主权项
地址