| 摘要 |
A mounting apparatus is provided for securing a heat dissipation module to a circuit board. A chip socket is placed on a top surface of the circuit board. The mounting apparatus comprises a plurality of posts detachably attached to the circuit board adjacent the chip socket, a support frame detachably attached to the heat dissipation module, and a plurality of connecting members respectively detachably attached to the posts. The support frame is attached to the connecting members by a plurality of fasteners, thereby securing the heat dissipation module to the circuit board and suspending the heat dissipation module over the chip socket. The mounting apparatus is provided for two mounting positions, one for during shipment of the circuit board and heat dissipation module, and the other one for operation of same.
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