| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for sufficiently and quickly removing the liquid from a film surface after the exposure liquid and cleaning liquid are placed in contact with the film to be exposed such as a resist film or a protective film formed thereon. <P>SOLUTION: In the method, a substrate on which the liquid is adhered is rotated in the maximum number of revolutions at the starting point of the removing step or reduced in its number of revolutions, or is rotated in the maximum number of revolutions at the ending point while it is rotated under the increasing number of revolutions less than the acceleration of 1,000 rpm or less. The maximum number of revolutions is maintained at the constant value at least for the predetermined period and it is preferably maintained at 2,500 to 5,000 rpm. <P>COPYRIGHT: (C)2007,JPO&INPIT |
