COMPONENT INCORPORATED SUBSTRATE, ELECTRONIC EQUIPMENT THEREWITH, AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a non-embedded component incorporated substrate capable of suppressing deformation of the shape of a via hole.

SOLUTION: The component incorporated substrate 100 is constituted by incorporating an electronic component, and comprises a stacked body 55 of a plurality of wiring layers 10 (11, 12); and an opening 50 is formed in the stacked body 55. The electronic component 20 is mounted on the wiring layer 11 where the opening 50 is formed, and a frame body 30 is formed at the circumference of the opening 50.

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