发明名称 MULTILAYER PRINTED CIRCUIT BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a multilayer printed circuit board, capable of reducing misoperations due to noise and suppressing the radiation noise to the outside, by shielding electromagnetic noise generated from each of planes to reduce the influence of noises generating from the circuit. <P>SOLUTION: When a power source layer is separated by different planes, a power source layer pattern 110 forms ground patterns 9 on slits 20 between planes. The ground patterns 9 are formed on the slits 20 between the power source planes A-F of the power source layer so as to be dragged on all the slits 20. This configuration can suppress electromagnetic radiation noises generated, in such a way that high-frequency power source current noises, flowing due to a high-speed switching operation of an integrated circuit element of signal layers 1, 7 will flow into the power source planes, and resonance noise of an LC circuit to be formed of the power source layer 5, a ground layer 3 and an integrated circuit element to be mounted are shielded; and thus, the electromagnetic radiation noise generated from the multilayer printed wiring board 110 can be suppressed. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007158243(A) 申请公布日期 2007.06.21
申请号 JP20050354959 申请日期 2005.12.08
申请人 RICOH CO LTD 发明人 SHIROHASHI MASARO
分类号 H05K3/46 主分类号 H05K3/46
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