| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroless nickel-plating liquid containing no lead, and to provide a plating method using the same. SOLUTION: The electroless nickel-plating liquid adopts a compound of a bismuth salt as a stabilizer, for example, bismuth ammonium citrate, bismuth potassium tartrate and bismuth sodium tartrate. Which easily dissolves in a high concentration of an electroless nickel-plating stock solution. Thus, the prepared electroless nickel-plating liquid has the bath life favorably compared with a conventional electroless nickel-plating liquid containing lead as the stabilizer, and imparts excellent electrically-resistive properties to a film 2 plated in the plating liquid. COPYRIGHT: (C)2007,JPO&INPIT
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