发明名称 DIE FORMING TOOL
摘要 PROBLEM TO BE SOLVED: To provide a mold which suppresses the abrasion of a mold forming tool and capable of manufacturing a pattern configuration with respect to a work hard to form the pattern configuration through already existing direct printing method such as quartz or the like especially, without wasting or destroying the mold and with excellent configuration transfer property. SOLUTION: The mold forming tool for transferring a recessed and projected configuration on the work includes the recessed and projected configuration consisting of diamond in contact with the work. Further, the mold forming tool is preferable to be a composite structure of more than two layers, in which diamond is formed on an auxiliary substrate. Further, the mold forming tool is preferable to have not less than 30% of light transmission in the region having wavelength of 5-100 μm. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007157962(A) 申请公布日期 2007.06.21
申请号 JP20050350187 申请日期 2005.12.05
申请人 SUMITOMO ELECTRIC IND LTD 发明人 IMAI TAKAHIRO;SEKI YUICHIRO
分类号 H01L21/027;B29C33/38;B81C99/00;C23C16/01 主分类号 H01L21/027
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