| 摘要 |
A stackable chip assembly is disclosed, as are different embodiments relating to same. The chip assembly preferably includes at least two substrates with components mounted on each. The substrates are preferably situated with respect to one another such that components on one substrate extend towards the other substrate and vice versa. The components of each substrate preferably extend or are interspersed between each other. Different connections between the substrates are disclosed, as well as methods of constructing such chip assemblies. In addition, a high G-force testing fixture is also disclosed for use in testing chip packages or the like. |
