| 摘要 |
The present invention is characterized by a resin composition for a thermal conductive material including a polymer (I), a liquid-state plasticizer (II) and a thermal conductive filler (III) having a thermal conductivity of 20 W/m.K or more, wherein the liquid-state plasticizer (II) is in a liquid state at 25° C., and has a mass loss rate of 2 mass % or less when kept at 130° C. for 24 hours. By using this resin composition for a thermal conductive material, it becomes possible to obtain a thermal conductive material having superior thermal conductivity and flexibility. |
